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  • TSV BIST™ DIE-LEVEL INTEGRITY MONITORS
  • TSV BIST™ DIE-LEVEL INTEGRITY MONITORS
  • TSV BIST™ DIE-LEVEL INTEGRITY MONITORS
  • TSV BIST™ DIE-LEVEL INTEGRITY MONITORS
TSV BIST™ DIE-LEVEL INTEGRITY MONITORS
2.5D ICs and 3D ICs are advanced packaging methodologies based on stacks of ICs that incorporate through-silicon vias (TSVs) for chip-to-chip communication: 2.5D ICs use an interposer to route the signals among the stacked chips, and 3D ICs use the TSVs to directly connect between the chips without the aid of an interposer. While the potential benefits of increased circuit density and performance are alluring, one of the hurdles the electronics industry must face is how to ensure the reliability of such components. These dense packages are created with new manufacturing technologies and must deal with a great deal of heat in a very small space and, without a long track record of field data to rely upon, it is difficult to project how well they will endure years into the future. This issue is magnified because some of the applications that could most benefit from 2.5D/3D IC technology – e.g., satellites, telecommunications, and transportation systems – are also among the most demanding when it comes to safety and reliability.
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2.5D ICs and 3D ICs are advanced packaging methodologies based on stacks of ICs that incorporate through-silicon vias (TSVs) for chip-to-chip communication: 2.5D ICs use an interposer to route the signals among the stacked chips, and 3D ICs use the TSVs to directly connect between the chips without the aid of an interposer. While the potential benefits of increased circuit density and performance are alluring, one of the hurdles the electronics industry must face is how to ensure the reliability of such components. These dense packages are created with new manufacturing technologies and must deal with a great deal of heat in a very small space and, without a long track record of field data to rely upon, it is difficult to project how well they will endure years into the future. This issue is magnified because some of the applications that could most benefit from 2.5D/3D IC technology – e.g., satellites, telecommunications, and transportation systems – are also among the most demanding when it comes to safety and reliability.

TSV-300

Through-silicon via

Ridgetop Group has developed a technology suite called TSV BIST™ which is the first to address this thorny problem. TSV BIST (BIST is an acronym for built-in self-test) consists of tiny monitors that are embedded into the 2.5D IC and 3D IC chip stacks that can detect degradation in the chip-to-chip interconnections, identify intermittencies, and ultimately warn of impending interconnect failure – before the failure actually occurs. TSV BIST incorporates and builds upon proven Ridgetop technology for board-to-package interconnection monitoring (SJ BIST™) and power and ground signal monitoring (Q-Star Test PG Mon™). TSV BIST is part of the Sentinel Interconnect™ family of products.
The following figures show how TSV BIST can be deployed as active monitors embedded in a 2.5D IC interposer (Figure 1), embedded in chips in a 2.5D IC stack (Figure 2), and embedded in chips in a 3D IC stack (Figure 3).
TSV-BIST-in-2-400
Figure 1. TSV BIST in 2.5D IC package – click to enlarge

TSV-BIST-Stacked-2-400

Figure 2. TSV BIST Stacked 2.5D IC package – click to enlarge
TSV-BIST-3D-IC-package-400
Figure 3. TSV BIST 3D IC package – click to enlarge
For more information, contact us directly, or follow the links below.
White Papers
Links to conference presentations on this subject can be found in our Resource Library
Related Products
· Sentinel Interconnect – Diagnostics and Prognostics Tools for Electrical Interconnectis
· SJ BIST Intermittency Detection
· Q-Star Test Products
· Sentinel Suite™Family of Advanced Diagnostics and Prognostics Tools
· Sentinel Motion™, a product  line  that  includes wireless vibration and motion signature monitoring sensors, prognostic reasoners, and a visualization tool
· Sentinel Power™, a product line for monitoring power systems, providing diagnostics and  prognostics analysis and visualization.
· Sentinel Interconnect™,  a product  line  that  includes embedded monitors for detecting intermittencies and degradation in crucial system interconnects, and a visualization tool
· Sentinel IT™, a  product  line  that  provides  solutions  for  improving  IT network  reliability and network health management (NHM).
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